抄録
In this study, a method for measuring the strain and stress distribution in structural materials has been introduced. The micro-creep deformation of the pure copper and the residual strains (stress) at the interface between fiber and matrix are measured. Fine model grids were fabricated by electron beam lithography and an electron beam scan of the scanning electron microscope (SEM) was used as a master grid. Exposure of the electron beam scan onto the model grid in an SEM produced the electron beam Moire fringes of bright and dark parts. Un-uniform strain distribution and grain boundary sliding were observed and analyzed. Also residual strain and stress around the fiber of fiber reinforced materials were measured.
