Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics
Online ISSN : 2424-2837
セッションID: OS10-1-4
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OS10-1-4 Effect of heat conduction on stress measurement based on the thermoelastic effect
Hirotsugu InoueKikuo Kishimoto
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Thermoelastic stress analysis is a full-field type stress measuring technique based on the thermoelastic effect of linearly elastic solids. Although adiabatic state is assumed in usual applications of the technique, heat transfer cannot be avoided in practice. In this paper, the effect of heat conduction inside the object on the temperature distribution is considered for plane stress problem. The distributions of the temperature amplitude and phase inside the specimen subjected to sinusoidal load are predicted by boundary element analysis and are measured with a lock-in thermography. It is demonstrated that the numerical and experimental results coincide very well with each other. A discussion on inverse heat conduction analysis for estimating correct stress distribution from measured temperature distribution is given.
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© 2007 一般社団法人 日本機械学会
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