The Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics
Online ISSN : 2424-2837
2011.10
Session ID : OS20-2-3
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OS20-2-3 Accurate Measurement of Temperature-Dependent Warpage of Electronic Packaging Using FLCOS-based Fringe Projection Profilometry
Shien RI, Takashi MURAMATSU, Masumi SAKA, Hiroyuki TANAKA, Yukihiro OKABE, Hiroshi SUZUKI
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Keywords: Warpage Measurement, Phase-Shifting Technique, Reflow Process, FLCOS microdisplay
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© 2011 The Japan Society of Mechanical Engineers
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