The Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics
Online ISSN : 2424-2837
2011.10
Session ID : OS20-2-4
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OS20-2-4 Warpage of Si/Solder/OFHC-Cu Layered Structures Subjected to Cyclic Thermal Loading
H. TanieM. TsudaK. NakaneY. UrataN. Ohno
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© 2011 The Japan Society of Mechanical Engineers
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