Abstract
Fabrication defects are one of the principle causes for yield reduction of wafers for IC manufacturers. Defects specification has been a highly problematic aspect of the wafer fabrication industry. Interconnect line shorts defects have a high potential of becoming fabrication yield killers for semiconductor manufacturing. Processes defects prevention should begin with an assessment of the critical risks associated with the semiconductor wafer manufacturing processes integration. Identifying the processes defects and implementing the best integrated processes for defect prevention techniques should be a high priority activity in any defect management of manufacturing process improvement. The solution in preventing defects is to understand the critical defect mechanism and risks facing the fabrication processes. It should be emphasized that defects mechanism is not to identify every conceivable risk, but to identify those critical risks of the root cause of defects formation because they could impact yield of wafer fabrication. Accurate control of the process defect of wafers is a important subject of semiconductor manufacturing industries. This paper presents comprehensive the investigating a process defects monitor and integration on semiconductor copper manufacturing process and technology, and module process integration of the problem of defects reduction on semiconductor manufacturing processes. Identification and optimal analysis of the fabrication process in which a defect originated to identify steps to improve the manufacturing process to prevent future occurrences of similar defects and integrated manufacturing processes implementation are also included.
