抄録
Electronic packaging is a series of processes toward the end of the microelectronics manufacturing, where functional semiconductors and discrete elements are electronically interconnected and mechanically assembled. Out-of-plane displacement or warpage is one of the major thermomechanical reliability concerns for board-level electronic packaging. In this study, temperature-dependent warpage distribution of electronic packaging is studied using FLCOS-based fringe projection profilometry. Phase-shifting technique effectively attains high resolution and high accuracy in analyzing phase information on a projected fringe pattern. A 50 by 50 mm size flip chip - ball grid array (FC-BGA) package was measured from 25 to 225℃ at 30℃/min rate. Experimental results show that our FLCOS-based measurement system using phase-shifting technique provides powerful means of monitoring and studying warpage in electronic packaging design and manufacturing reflow processes.
