The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2000.13
Conference information
Effect of Material Properties on Delamination Strength between ACF and a Chip in an Electronic Device
Takashi KUWAHARA, Toru IKEDA, Noriyuki MIYAZAKI, Yuya UENO, Kazuhiro ISAKA, Masami YUSA
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Keywords: Structual Analysis, Finite Element Method, Fracture Mechanics, Electronic Packaging, Delamination Strength, ACF
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 663-664

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© 2000 The Japan Society of Mechanical Engineers
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