Development of Flip Chip Bonding Technology (NSD Method) Using Resin Encapsulation Sheet : Examination of Joint Reliability and Physical Property using FEM
Kazuto NISHIDA, Hidenobu NISHIKAWA, Kenichi YAMAMOTO, Kazumichi SHIMIZU, Kazuyuki TOMITA, Hideo KOGUCHI
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Pages 665-666
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Article 1st page
