抄録
When the piezoelectric film is glued on the surface of a cracked material subjected to mechanical load, change in distribution of electric potential is observed on the surface of piezoelectric film. Based on this phenomenon, passive electric potential CT(computed tomography) method was developed for the identification of two- and three-dimensional cracks based on the FEM inverse analysis. In this paper, this method was applied to identify 3-D surface crack opening on the back surface. Numerical simulations were carried out on determination of location and size of back surface crack. It was found that crack parameters were identified within the error of 1.0%, when the noise level of observed electric potential distribution was lower than 0.1%.
