The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2001.14
Session ID : 431
Conference information
431 Ultra Thin Packaging by Flip Chip Bonding Technology Using Resin Encapsulation Film
Kazuto NISHIDA, Yoshihiko YAGI, Michirou Yoshino, Kazumichi SHIMIZU, Hideo KOGUCHI, Chie SASAKI
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Keywords: Packaging, Encapsulation Film, Flip Chip, Finite Element Method
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© 2001 The Japan Society of Mechanical Engineers
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