The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2001.14
Session ID : 430
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430 Viscoelastic Analysis of CSP Electronic Devices Package
Hideo Koguchi, Chie Sasaki, Kazuto Nishida
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Keywords: Chip Size Package, thermo-viscoelastic analysis, multi-layerd theory of plate
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© 2001 The Japan Society of Mechanical Engineers
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