The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2001.14
Session ID : 435
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435 The Dynamic Characteristics of Solder Joints of BGA Package subjected to Dropping Impact
Qiang YU, Masaki SHIRATORI, Hironobu KIKUCHI, Shinya IKEDA
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Keywords: Dynamic Behavior, Dynamic Analysis, Response Analysis, Impact Reliability, Impact Fatigue, BGA Package
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© 2001 The Japan Society of Mechanical Engineers
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