The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2001.14
Session ID : 436
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436 Estimation of Interface Fatigue Crack initiation and propagation in Sn-Ag-Cu-Bi solder joint
Qiang YU, Masaki SHIRATORI, Do Seop KIM, Yasuhiro TAKAHASHI
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Keywords: Sn-Ag-Cu-Bu, Solder joint, Fatigue strength, Crack propagation, Stress intensity factor, Intermetallic compound
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© 2001 The Japan Society of Mechanical Engineers
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