The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2001.14
Session ID : 438
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438 Assemble Process Analysis of BGA Package
Hidehisa SAKAI, Masahide KANEKO, Qiang YU, Masaki SHIRATORI
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Keywords: Young's Modulus, CTE, BGA
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© 2001 The Japan Society of Mechanical Engineers
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