The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2001.14
Session ID : 437
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437 Strength reliability prediction for solder joints of electronics products using response surface methodology
Kenji HIROHATAMinoru MUKAINoriyasu KAWAMURATakashi KAWAKAMIKei MATSUOKAKatsumi HISANOFumihiro IWAMIKuniaki TAKAHASHIYu QIANGMasaki SHIRATORI
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© 2001 The Japan Society of Mechanical Engineers
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