437 Strength reliability prediction for solder joints of electronics products using response surface methodology

The Proceedings of The Computational Mechanics Conference

Online ISSN : 2424-2799

2001.14

Session ID : 437

DOI https://doi.org/10.1299/jsmecmd.2001.14.477

Conference information

437 Strength reliability prediction for solder joints of electronics products using response surface methodology

Kenji HIROHATA, Minoru MUKAI, Noriyasu KAWAMURA, Takashi KAWAKAMI, Kei MATSUOKA, Katsumi HISANO, Fumihiro IWAMI, Kuniaki TAKAHASHI, Yu QIANG, Masaki SHIRATORI

Author information

Kenji HIROHATA
Toshiba Corporation
Minoru MUKAI
Toshiba Corporation
Noriyasu KAWAMURA
Toshiba Corporation
Takashi KAWAKAMI
Toshiba Corporation
Kei MATSUOKA
Toshiba Corporation
Katsumi HISANO
Toshiba Corporation
Fumihiro IWAMI
Toshiba Corporation, Digital media network company
Kuniaki TAKAHASHI
Toshiba Corporation, Digital media network company
Yu QIANG
Yokohama National University
Masaki SHIRATORI
Yokohama National University

Keywords: Response Surface Methodology, Statistical Design Support System, Thermal stress, Finite Element Method, Structural reliability, Solder joint, Probabilistic method

CONFERENCE PROCEEDINGS FREE ACCESS

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© 2001 The Japan Society of Mechanical Engineers

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