The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2001.14
Session ID : 445
Conference information
445 Determination Method of Material Parameters Used in Elastic-Plastic-Creep Model for Solder Alloys
Ken-ichi OHGUCHI, Katsuhiko SASAKI
Author information
Keywords: Solder Alloy, Elastic-Plastic-Creep Model, Creep, Electronic Packaging
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (315K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2001 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Share this page
feedback
 Top