The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2001.14
Session ID : 446
Conference information
446 Simulation of Thermal Deformation of Solder Joints in Reflow Process : Comparison of Pb Solder with Pb Free Solder
Ken-ichi OHGUCHI, Hiroshi NONOYAMA, Katsuhiko SASAKI, Michihiro TAGAMI
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Keywords: Pb Free Solder, Electronic Packaging, Thermal Deformation, Constitutive Model, FEM
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© 2001 The Japan Society of Mechanical Engineers
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