The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2001.14
Session ID : 448
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448 Stress Analysis of Lead-Free Solder Joint using Inelastic Constitutive Modeling
Minoru MUKAIHiroyuki TAKAHASHITakashi KAWAKAMITakaji KOBAYASHIKuniaki TAKAHASHIMineo KOBAYASHINobutada OHNOTomofumi ISHIKAWA
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© 2001 The Japan Society of Mechanical Engineers
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