447 Analysis of Thermal Deformation of Electronic Device Connection : Introduction of Viscoplastic Constitutive Model

Abstract

In this paper, viscoplastic constitutive model for deformation of Pb free solder alloys was proposed. FEM analysises of microelectronics solder joints was also conducted using the viscoplastic constitutive model. For the FEM analysis, basic experiments, such as pure tension, cyclic loading and creep tests were conducted using Sn-3.5Ag-0.75Cu solder alloy at several tests conditions. As a result, it was found that the thermal deformation of the solder alloy was successfully simulated by the FEM analysis, into which the constitutive model was incorporated.