The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2002.15
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Thermal Deformation Analysis of Electronic Device using Finite Element Method and Moire Interferometry
Mitsugu TODO, Yasuyuki MORITA, Kazuo ARAKAWA
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Keywords: Stacked-MCP, Moire Interferometry, Thermal Deformation, Finite Element Analysis
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 333-334

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© 2002 The Japan Society of Mechanical Engineers
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