The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2003.16
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Temperature analysis of the thin plate in roll compression of the wood
Daisuke IKEGAMITakumi NAKAMURATomoaki TSUJIYoshihiro OBATAKozo KANAYAMA
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 271-272

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Abstract
The purpose of this research is to make the simulation model in order to design the roll press equipment for the wood board. In the first step of the research, we investigate the temperature analysis of the wood board under the roll press. The thermal conductivity is related with the temperature. The temperature distributions of the wood board are obtained for the few temperature conditions. The results are compared to the experimental data.
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© 2003 The Japan Society of Mechanical Engineers
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