計算力学講演会講演論文集
Online ISSN : 2424-2799
会議情報
351 木材のロール圧延における薄板の温度解析
池上 大輔中村 匠辻 知章小畑 良洋金山 公三
著者情報
会議録・要旨集 フリー

p. 271-272

詳細
抄録
The purpose of this research is to make the simulation model in order to design the roll press equipment for the wood board. In the first step of the research, we investigate the temperature analysis of the wood board under the roll press. The thermal conductivity is related with the temperature. The temperature distributions of the wood board are obtained for the few temperature conditions. The results are compared to the experimental data.
著者関連情報
© 2003 一般社団法人 日本機械学会
前の記事 次の記事
feedback
Top