The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2003.16
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Thinning effect of semiconductor chips on stress distribution at surface of the chips in flip chip structures
Hideo MIURA
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Keywords: Residual Stress, Stress Analysis, Finite Element Method, Electronic Packaging, Reliability
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 671-672

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© 2003 The Japan Society of Mechanical Engineers
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