The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2003.16
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A Synergistic Effect of Thermal Cycle and Bending on the Reliability of Ceramics-Metal Joint body Semiconductor Substrates
Mitsuyoshi TSUTSUMI, Nagatoshi OKABE, Xia ZHU
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Keywords: Substrate For Semiconductor, Ceramics-Metal Joint body, Thermal Cyclic Test, Bending
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Pages 685-686

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© 2003 The Japan Society of Mechanical Engineers
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