Stress Analysis of Single-and Double-Sided CSP

The Proceedings of The Computational Mechanics Conference

Online ISSN : 2424-2799

2003.16

DOI https://doi.org/10.1299/jsmecmd.2003.16.693

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Stress Analysis of Single-and Double-Sided CSP

Hideo Koguchi, Mirai Ishida, Mitsuhiro Takabatake, Kazuto Nishida

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Keywords: Chip Size Package, Flip Chip, Finite Element Method

CONFERENCE PROCEEDINGS FREE ACCESS

Pages 693-694

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Article 1st page

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© 2003 The Japan Society of Mechanical Engineers

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