The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2004.17
Session ID : 0106
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Evaluation of Residual Stress in Resin-molded IC Chips
Masaaki KOGANEMARU, Toru IKEDA, Eisuke MORI, Noriyuki MIYAZAKI
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Keywords: Piezoresistive gauge, Finite element method, Thermal deformation, Residual stress, Electronic package
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© 2004 The Japan Society of Mechanical Engineers
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