The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2007.20
Session ID : 107
Conference information
107 Study on Relation between Phase Growth and Mechanical Parameter in Sn-3.0Ag-0.5Cu Solder Joints
Yasuhiro EJIRI, Takao MORI, Toshihiko SAYAMA, Takeshi TAKAYANAGI, Yoshiyuki OKAMOTO, Qiang YU
Author information
Keywords: Phase Growth, Lead-free Solder, Sn-3.0Ag-0.5Cu, Fatigue, Reliability, Finite Element Method
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (315K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2007 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Share this page
feedback
 Top