The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2007.20
Session ID : 110
Conference information
110 Thermal stress analysis in a semiconductor-joint module after processing and in operation
Tomoya DEGUCHI, Keiji OGI, Manabu TAKAHASHI, Syunsuke TOHI
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Keywords: Semiconductor-metal joints, Residual stress, Interface, Thermal stress, Stress intensity factor
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© 2007 The Japan Society of Mechanical Engineers
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