The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2010.23
Session ID : 601
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601 Simulation of the Via-filling by Electrodeposition Using Boundary Element Method
Keisuke HAYABUSA, Masashi SHIMOYAMA, Kenji AMAYA
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Keywords: Electroplating, Electrodeposition, Boundary Element Method, Numerical Simulation
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© 2010 The Japan Society of Mechanical Engineers
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