The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2010.23
Session ID : 1712
Conference information
1712 A Study on the Thermal Deformation and the Mechanical Properties Due to Curing Process of the Encapsulation Resin
Hiroyuki SATO, Qiang YU, Ryusuke SONE
Author information
Keywords: resin, cure shrinkage
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (343K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2010 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Share this page
feedback
 Top