The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2010.23
Session ID : 1713
Conference information
1713 Evaluation of Residual Stress in Semiconductor Chips Caused by the Combination of Materials in Packages Using Piezoresistive Test Chips and the Digital Image Correlation Method
Kazutoshi MATSUDA, Toru IKEDA, Noriyuki MIYAZAKI
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Keywords: Finite Element Method, Viscoelastic Analysis, Piezoresistive, Warpage
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© 2010 The Japan Society of Mechanical Engineers
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