抄録
A coupling analysis of DEM and SPH has been developed for 3-dimensional powder packing process. The powder materials in compression are initially modeled by DEM and after the time when the material is fully compressed SPH has been applied to obtain the stress and strain distributions in a product. The GPU has been utilized to decrease the computing time. It has been cleared that this method is valuable for the analysis of 3-dimensional powder-packing analysis.
