The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2011.24
Session ID : 106
Conference information
106 Electric Field Analysis of Evaluation Method of Interface Crack under Solder Ball without Influence of Deformation of Copper Plate Specimen
Ryo NISHIHARA, Naoya TADA, Ryuji TAKEHARA
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Keywords: Interface crack, Direct current potential difference method, Solder ball, Copper plate deformation
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© 2011 The Japan Society of Mechanical Engineers
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