104 Specimen size effect on interface adhesion measurement for Cu metallization systems in integrated circuits

The Proceedings of The Computational Mechanics Conference

Online ISSN : 2424-2799

2011.24

Session ID : 104

DOI https://doi.org/10.1299/jsmecmd.2011.24.9

Conference information

104 Specimen size effect on interface adhesion measurement for Cu metallization systems in integrated circuits

Nobuyuki SHISHIDO, Chuantong CHEN, Shoji KAMIYA, Masaki OMIYA, Hisashi SATO, Masahiro NISHIDA, Takashi SUZUKI, Tomoji NAKAMURA, Takeshi NOKUO, Tadahiro NAGASAWA

Author information

Nobuyuki SHISHIDO
Nagoya Institute of Technology:JST
Chuantong CHEN
Graduate School of Nagoya Institute of Technology
Shoji KAMIYA
Nagoya Institute of Technology:JST
Masaki OMIYA
Keio University:JST
Hisashi SATO
Nagoya Institute of Technology:JST
Masahiro NISHIDA
Nagoya Institute of Technology:JST
Takashi SUZUKI
Fujitsu Laboratories Ltd.
Tomoji NAKAMURA
Fujitsu Laboratories Ltd.
Takeshi NOKUO
JEOL Ltd.:JST
Tadahiro NAGASAWA
JEOL Ltd.:JST

Keywords: Adhesion, Interface, Delamination, Integrated Circuits, Toughness

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© 2011 The Japan Society of Mechanical Engineers

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