The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2013.26
Session ID : 107
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107 Prediction of Energy Release Rate Distribution over Cu/Insulator Interface in LSI devices by TCAD Process Simulator
Atsushi KUWABAYASHI, Masaki OMIYA, Kozo KOIWA, Nobuyuki SHISHIDO, Shoji KAMIYA, Hisashi SATO, Masahiro NISHIDA, Takashi SUZUKI, Tomoji NAKAMURA, Toshiaki SUZUKI, Takeshi NOKUO
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Keywords: Adhesion, Interface, Crack, Energy Release Rate, Numerical Simulation, LSI
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© 2013 The Japan Society of Mechanical Engineers
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