The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2014.27
Conference information
Microtexture dependence of stress-induced migration of copper thin film interconnections
Ken Suzuki, Hideo Miura
Author information
Keywords: Molecular dynamics, Electroplated copper thin film, Residual stress, stress-induced migration
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 100-101

Details
Download PDF (369K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2014 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Share this page
feedback
 Top