The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2014.27
Conference information
Examination of Residual Stress Evaluation of Resin-Molded Semiconductor Chip Using Phase-Shifted Sampling Moire Method
Masaaki Koganemaru, Masakazu Uchino, Akihiro Ikeda, Tanemasa Asano
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Keywords: Electronic Package, Residual Stress, Phase-Shifted Sampling moire Method, X-Ray Image, Non-Distractive Measurement
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Pages 98-99

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[in Japanese]
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© 2014 The Japan Society of Mechanical Engineers
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