The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2015.28
Session ID : 11
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011 Effect of material properties of Al pad on the strength of wire bonding
Kenta Shiba, Toru Ikeda, Keisuke Nakano, Ryuichi Kusama
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Keywords: Wire Bonding, Shear Test, SEM-EBSD, Nano-indentation, Bonding Strength
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[in Japanese]
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© 2015 The Japan Society of Mechanical Engineers
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