The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2015.28
Session ID : 12
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012 Evaluation of the delimitation strength of an interface between molding resin and substrate in a power device
Akiko Ozaki, Toru Ikeda, Hiroshi Nakaido, Takuya Hatao
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Keywords: Power device, Stress intensity factor, Resin, H-integral
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© 2015 The Japan Society of Mechanical Engineers
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