数結晶粒よりなる微細すず試験片のひずみ測定と有限要素法を用いた結晶塑性解析

抄録

Soldering is used for bonding a print circuit board (PCB) and a semiconductor chip. It is known that Sn, which is the base metal of Pb-free solder, shows remarkable crystal anisotropy. To clarify the effect of anisotropy of Sn on strain distribution is important for lifetime evaluation. The strain distribution in a micro specimen under a tensile test was measured by a digital image correlation method (DICM) with a microscope. The strain distribution was also analyzed by the crystal plasticity finite element analysis (CPFEA) considering the critical resolves shear stress (CRSS) of each slip system. The deformation of the crystal structure of β-Sn depends on the size, number and orientation of crystal grains. The CRSS was noticeably different for each slip system, and the yield stress varied with the orientations of crystal grains. Although the CPFEA without considering strain hardening was effective for predicting deformation within crystal grains, it is necessary to consider the strain hardening of crystals to predict the stress-strain curve of a micro-specimen.