フッ素樹脂銅張積層板の寸法安定性シミュレーション

抄録

Fluororesin has low dielectric constant and dielectric tangent. For that reason, it has attracted attention as a material for high frequency substrate that reduce transmission loss in high-frequency bands in 5G communications. However, Fluororesin has a high coefficient of thermal expansion (CTE), which raises concerns about the dimensional stability of the substrates during the lamination process. Therefore, in this paper, we propose a simulation method for evaluating the dimensional stability of the substrates considering lamination process by the finite element method (FEM) for copper-clad laminates (CCL). In this method, the laminated molding of the substrate is expressed by the birth and death of elements, and the deformation of the substrate due to it is removed by forced displacement. The validity of this method was confirmed by comparing the calculation results with the test results.