構造因子を組み込んだBGA半導体パッケージはんだ接合部の熱疲労駆動力の統計的予測

抄録

The dominant factor governing the thermal fatigue driving force ΔW_in square BGA semiconductor package solder joints is the interaction between PCB thickness and Si die size, for which a response surface equation was derived. For structures with thicker PCBs and larger Si, the single factors of mold thickness and package substrate thickness were highly significant among other structural factors. The response surface also depended on the temperature range and the high temperature hold time. In the case of the rectangular package, the PCB thickness - Si die size interaction was also dominant, and its response surface had the same shape as for the square package and ΔW_in depended on the package aspect ratio. By reflecting the high temperature hold time, temperature range and single structure factor, and package aspect ratio in the response surface equation of the square shape of PCB thickness - Si die size, the ΔW_in of the BGA semiconductor package solder joint can be easily predicted.