The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2002
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Impact Tensile Properties of Lead-free Solder
Ken KAMINISI, Takesi MARUICHI, Tsutomu SEKINE, Shigeyuki HARUYAMA, Toshifumi OGAWA
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Keywords: Lead-free Solder, Hopkinson Bar, Sn-37Pb Solder, Sn-3.0Ag-0.5Cu Solder, Sn-3.0Ag-0.5Cu-1.0Bi Solder, Impact Tensile Test
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© 2002 The Japan Society of Mechanical Engineers
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