The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2004.42
Session ID : 213
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Thermo-Viscoelastic Properties of Adhesives used for Electronic Devices in Curing Processes
Yusuke SAKATA, Ryuichi UNOKI, Shozo NAKAMURA
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Keywords: Adhesive, Viscoelasticity, Tensile Property, Curing, Degradation, Electronic Device, SEM Observation
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© 2004 The Japan Society of Mechanical Engineers
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