The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2004.42
Session ID : 214
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FEM Analysis of Residual Stress around the Joint Part in Electronic Devices
Yoshiyuki KUSHIZAKI, Ryuichi UNOKI, Motoki OKINO, Shozo NAKAMURA
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Keywords: Residual Stress, FEM, COB Package, Resin, Young's Modulus
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© 2004 The Japan Society of Mechanical Engineers
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