The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2012.50
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113 Effect of Cooling Conditions to Residual Warpage for Laminated body Consisting of Epoxy resin, Steel and Printed Board
Akihiro KONDO, Ryosuke MIYAOKA, Syota NAKAGAWA, Syozo NAKAMURA
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Keywords: Viscoelasticity, Cooling Conditions, Holding Temperature, Epoxy resin, Residual Warpage
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Pages 11301-11302

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© 2012 The Japan Society of Mechanical Engineers
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