Abstract
The performance enhancement and the size reduction of the digital consumer products cause the elevation of packaging density. These subjects make the packaging design difficult for mechanical designers, and new design optimal solutions are needed without compromising the size, weight and performance. Although 3D-CAD and CAE become a part of engineer's daily routine in recently, effective integrity interface between the virtual design tool and real humanistic collaboration process is the most important key to accomplish the innovative synthesis. This paper proposes a new Japanese collaboration approach "Middle-up-down design method". Also this method is outlined through an application for MITSUBISHI ultra-slim notebook PC "Pedion" development. As of September 1997,"Pedion" was the world's thinnest at 18mm thick among A4-size notebook for Windows and performance effectiveness of our middle-up-down design method was proved for innovative synthesis.
