Abstract
The present trend of power device packaging indicates that there is a high customer's demand in regarding high reliability. Cooling not only keeps the power device temperature to a specific value, but also affects the solder strain caused by the thermal expansion. Therefore, thermal deign strongly influences the mechanical reliability. In the present paper, the power unit design was completed utilizing the new six sigma approach called DFACE. The main purpose of DFACE is not cost reduction but sales increase, by designing products and business processes meeting customer requirements and generating new value. DFACE (Define, Focus, Analyze, Create, Evaluate) is the project management framework used to achieve these results, using several famous tools and concepts such as PDAC, CVCA, Scorecarding, QFD, Taguchi, AHP, TRIZ... in a systematic approach.
