シミュレーション, サロゲイト, セットベースの各モデルにおける設計工数比較

（電子基板とICチップの熱伝導・応力設計の例題を用いて）

抄録

A qualitative comparison of the effort required to obtain design solutions using three representative simulation techniques that are essential in current product design technology is conducted. These techniques include the conventional CAE simulation method, the surrogate method combined with machine learning, and the set-based method. The comparison is mainly based on a qualitative assessment considering the characteristics of each method as a technique for representing the performance behavior of the product under design. For the set-based method, which is not yet widely adopted, an example problem involving the thermal conduction and stress design of an electronic substrate with two IC chips is used to facilitate its explanation. In conclusion, it can be stated that all methods are based on CAE simulations grounded in 3D-CAD modeling, and among them, the set-based design method requires significantly less design effort to obtain solutions. Therefore, in terms of design workload, the set-based method can be considered the most efficient．