Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : November 29, 2018 - November 30, 2018
In semiconductor production, efficiency and precision of the cleaning process are very important. In this study, we handle “Single Wafer Cleaner” that is one of the washing methods in the way of blowing air to a wafer with a turning disk at a high speed. However, the flow in the device becomes turbulent, which causes the problem that water drops and dusts re-attach to the wafer surface. Therefore, it is necessary to understand the flow in the device exactly to solve this problem. In previous studies, we experimented to establish the method of understanding the flow in the semiconductor wafer cleaner without a covering cup that is used for liquid splash preventing. In this study, numerical calculations were performed to observe the flow in the device to study influence of covering cup and find a suitable turbulence model to simulate the experiment.
